Petaling Jaya, Malaysia – August 13, 2026 – NXP Semiconductors N.V. (NASDAQ: NXPI) recently broke ground on its new packaging and testing plant in Petaling Jaya, Malaysia. This expansion of the company’s existing packaging and testing facilities will further strengthen NXP’s global manufacturing footprint and increase internal capacity to support greater supply chain resilience and flexibility.
The groundbreaking ceremony brought together government officials, partners, and NXP executives and team members to witness this milestone. NXP was also honored to have His Excellency Gobind Singh Deo, Minister for Digital and Information Technology of Malaysia, and His Excellency Jacques Werner, Ambassador of the Kingdom of the Netherlands to Malaysia, in attendance and to deliver speeches.
The new plant will add approximately 500,000 square feet of manufacturing space, further expanding NXP’s existing operations in Malaysia. NXP's existing facility in Malaysia focuses on packaging and testing to support NXP's broad product portfolio. The new plant will bring the total production area to approximately 900,000 square feet.
The new plant is expected to begin phased production in the first quarter of 2028, and upon full operation, its total output is projected to more than double. The added packaging and testing capacity will strongly support the future growth of NXP's entire manufacturing ecosystem, including the anticipated output of the VSMC joint venture in Singapore and the ESMC joint venture in Dresden, Germany.
Andy Micallef, Executive Vice President and Chief Operating and Manufacturing Officer at NXP, stated, "For decades, Malaysia has been a vital part of NXP's global manufacturing footprint, thanks to its strong semiconductor ecosystem and excellent talent pool. This expansion will further enhance our assembly and testing capacity while strengthening the resilience and flexibility of our supply chain for our global customers through operational diversification."
The plant is positioned as a highly automated smart factory, equipped with an Automated Material Handling System (AMHS) and advanced quality management technologies to optimize manufacturing processes, improve efficiency, and ensure high-quality production.
Expanding its in-house packaging and testing capacity is a key component of NXP's hybrid manufacturing strategy, designed to provide greater flexibility, supply chain control, and geographic diversification. The expanded Petaling Jaya site will complement NXP's existing packaging and testing facilities in Greater China and Thailand, helping to maintain a balanced and globally diversified manufacturing network.
Since establishing its base in Malaysia in 1972, NXP has built a long-standing and robust production presence there, a key hub in its global supply chain. In addition to expanding manufacturing capacity, NXP continues to invest in Malaysia's future engineering talent pool through strategic partnerships with local universities, supporting engineering education and fostering research collaborations to help cultivate Malaysia's next generation of semiconductor talent.
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